Application Industries
Semiconductor Packaging
Detects delamination, cracking, and electrical failures of chips and packages under rapid temperature cycling.
Automotive Power Batteries
Validates the structural safety and electrical performance consistency of battery modules and BMS under thermal shock.
Industrial Sensors
Evaluates the measurement accuracy and sealing reliability of pressure and temperature sensors under sudden temperature changes.
Product Features
High-Efficiency Transfer
Sample transfer time ≤3 seconds, supports thermal shock in the range of -70°C to +200°C, with a temperature change rate of up to 50°C/min.
Precise Control
Dual-chamber independent high-precision PID control ensures temperature fluctuations ≤±0.3°C, guaranteeing stable and repeatable shock processes.
Intelligent Management
Built-in test program library and data traceability system, supports barcode scanning for sample binding and automatic report generation.
Sales Q&A
Q: How is temperature fluctuation in the test area prevented during sample transfer?
A: Utilizes air pressure sealing and buffer zone isolation design, completely isolating air exchange between chambers during transfer to maintain a constant temperature in the test area.
Q: Does it support simultaneous testing of multiple sample groups under different conditions?
A: Yes, with partitioned sample basket management, dual sample baskets can be optionally configured for synchronous operation, enabling simultaneous testing under different temperature conditions.
Q: How should the equipment be restarted after long-term inactivity?
A: It is recommended to perform a system self-check and no-load temperature field calibration, followed by a 24-hour pre-operational power-on to ensure stable equipment performance.
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