Application Industries
Power Semiconductors
Tests the substrate solder fatigue and thermal resistance changes of IGBT and SiC modules under thermal shock.
Precision Optics
Validates lens deformation and imaging stability of lenses and sensors under rapid temperature changes.
Medical Devices
Evaluates the material compatibility and functional integrity of surgical instruments and implants under extreme and sudden temperature variations.
Product Features
Dynamic Shock Technology
Utilizes pneumatic or electric-driven transfer mechanisms, with sample transfer time ≤8 seconds and a maximum temperature change rate of 30°C/second.
Interference-Free Design
The high-temperature and low-temperature zones are completely isolated, preventing cross-interference of hot and cold airflows and reducing temperature recovery time by 50%.
Adaptive Control
Intelligently learns the thermal capacity of samples, automatically adjusting dwell time and transfer节奏 to ensure precise replication of shock curves.
Sales Q&A
Q: Is there a risk of mechanical damage to samples during transfer?
A: The transfer mechanism is equipped with buffering devices and flexible clamps, with displacement accuracy of ±0.5mm, effectively preventing collision and vibration damage.
Q: Does it support static shock testing for non-powered samples?
A: Yes, the transfer function can be disabled, allowing samples to be fixed in a single temperature zone for static thermal shock testing.
Q: How is the transfer mechanism maintained after long-term use?
A: Transfer rails require monthly cleaning and lubrication, and drive components need precision calibration every 2,000 hours. The device provides automatic maintenance reminders.
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