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High and Low Temperature Thermal Shock and Vibration Tester
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High and Low Temperature Thermal Shock and Vibration Tester

High and Low Temperature Thermal Shock and Vibration Tester

The High and Low Temperature Thermal Shock and Vibration Tester is a reliability testing device that simulates thermal shock environments through rapid temperature switching. It achieves instantaneous transitions between high and low temperatures within the range of -70°C to +200°C, used to evaluate the structural stability, electrical performance, and failure modes of products and materials under severe temperature differentials.
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Product Introduction

Application Industries​ 

 
 

Semiconductor Power Modules

Tests solder joint fatigue, substrate cracking, and thermal resistance drift of IGBT/SiC modules under sudden temperature changes.

 
 
 

Precision Optical Lenses

Validates the surface accuracy and imaging stability of aerospace camera lenses and LiDAR optical components under thermal shock conditions.

 
 
 

Biomedical Materials

Evaluates the maintenance of biocompatibility and microstructural integrity of bone implants and dental materials under cold and heat shock.

 

52--56

product-1000-539

 

Product Features

 

Millisecond-Level Temperature Switching

Utilizes pneumatic ejection or magnetic levitation transfer technology, with sample transfer time ≤5 seconds and a maximum temperature change rate of 40°C/second.

Dual-Zone Independent Temperature Control

The high-temperature and low-temperature zones are fully isolated with independent temperature control, achieving temperature stability ≤±0.5°C and supporting nonlinear thermal shock curve programming.

Intelligent Damage Monitoring

Integrated acoustic emission sensors and high-speed camera systems enable real-time capture and data recording of failure processes such as sample cracking and delamination.

1-201025135Z9119
1-201025135ZR56
1-201025135ZRb
1-201025135ZW95
1-201025135ZY57
1-201025195S0193001

 

product-1500-1400

 

Sales Q&A

 

 

Q: Is there a risk of sample damage due to collisions during transfer?

A: The transfer mechanism is equipped with multi-dimensional buffering and flexible clamps, with displacement repeatability ≤±0.2mm, and supports real-time collision force monitoring and emergency stop protection.

Q: Does it support thermal shock testing on powered samples?

A: Provides live testing interfaces and insulated transfer modules, supporting thermal shock testing with voltages up to 1000V and currents up to 200A, with real-time monitoring of electrical parameters.

Q: How is the transfer mechanism maintained after long-term operation?

A: The transfer rails feature self-lubricating design and require cleaning and inspection every 5,000 cycles. The drive system includes a lifespan预警, allowing for proactive maintenance scheduling.

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